Electronic Devices White Papers

(View All Report Types)
Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

5 Reasons Environmental Sensors are used in all Modern Data Centers
sponsored by Raritan Inc.
WHITE PAPER: This whitepaper offers five reasons you should consider implementing environmental sensors in your data center.
Posted: 25 Mar 2014 | Published: 25 Mar 2014

Raritan Inc.

Prepare, predict, pinpoint: HP Operations Analytics
sponsored by Hewlett Packard Enterprise
WHITE PAPER: In this white paper, discover the best way to manage all of this data: by exploiting big data management and analytics. Read on now to learn about one standalone solution that offers the means to collect and analyze huge data volumes from multiple perspectives, and provides tremendous opportunities to IT operations.
Posted: 21 Feb 2014 | Published: 31 Dec 2013

Hewlett Packard Enterprise

3D printing: bringing better products to market faster
sponsored by Stratasys, Ltd
WHITE PAPER: Discover how 3D printing can help your organization bring better products to market faster.
Posted: 28 Apr 2014 | Published: 28 Feb 2014

Stratasys, Ltd

Oracle Exalogic Elastic Cloud: System Overview
sponsored by Oracle Corporation
WHITE PAPER: Read this white paper to learn about Oracle Exalogic Elastic Cloud, an Engineered System consisting of software, firmware, and hardware designed to meet the highest standards of reliability, serviceability and performance.
Posted: 09 Apr 2012 | Published: 15 Sep 2011

Oracle Corporation

IT Security: Built-In Protection with Intel vPro Technology
sponsored by Intel
WHITE PAPER: New security threats are constantly emerging, and it is your responsibility to properly protect your business. This white paper discusses four key aspects of IT security and explains how you can effectively address them by implementing processors with built-in security features.
Posted: 12 Jun 2012 | Published: 01 May 2012

Intel

IBM System x3650 M4 Servers Data Sheet
sponsored by IBM and Intel.
WHITE PAPER: Explore this datasheet to learn about a scalable server package that can save your enterprise money without sacrificing speed or availability.
Posted: 07 Jul 2014 | Published: 14 Sep 2013

IBM and Intel.

Wyse Intel-Based 3000 Series Thin Client: Powerful, Highly Configurable
sponsored by Dell
WHITE PAPER: Get a quick look at the Wyse Intel-based 3000 series thin client, a solution capable of driving a range of applications.
Posted: 13 Nov 2014 | Published: 11 Nov 2014

Dell